Difference between DELIKE and Other Materials

 

DELIKE Epoxy Resin

Phenolic Core Board

Chemical Resistant Laminate

Compo - sition

Molde from epoxy resin, silica, hardener & pigment

Thermosetting resins reinforced with cellulose from overlay ,decorative paper & kraft paper

Laminated from overlay, decorative paper & kraft paper

Usage

Self-supporting

Self- supporting

Non-self- supporting, bonded with substrate

Reagent Resis - tance

Affected by Nitric Acid68%&Sulfuric Acid98%

Affected by Nitric Acid65% , Sulfuric Acid98%,Chromic Acid60%,Hydrofluoric Acid48%& Phenol

Affected by Nitric Acid65% , Sulfuric Acid98%,Chromic Acid60%,Hydrofluoric Acid48%& Phenol

Heat Resistance

Resistant to 600íŠ, do not ignite or blister or crack when exposed to direct flame

Resistant to 135íŠ ,not to be exposed to direct flame

Resistant to 135íŠ ,not to be exposed to direct flame

Reparability

Monolitic , non-porous ,reparable when scratched

lrreparable when scratched on the surface

lrreparable when scratched on the surface

Compressive Strength

40,100psi

21,500psi

-

Flexural Strength

7úČ400psi

13,040psi

-

Tensile Strength

11úČ100psi

20,510psi

-

Rockwell M Hardness

93,7

69

-

Thermal Coefficient of Expansion

1.48*10-5in./OF

1.291*10-5in./OF

-

Water Absorption

0.05%

0.71%

-

Moisture Resistance

Excellent

Good

Poor

NEWS

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