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Difference between DELIKE and Other Materials |
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DELIKE Epoxy Resin |
Phenolic Core Board |
Chemical Resistant Laminate |
Compo - sition |
Molde from epoxy resin, silica, hardener & pigment |
Thermosetting resins reinforced with cellulose from overlay ,decorative paper & kraft paper |
Laminated from overlay, decorative paper & kraft paper |
Usage |
Self-supporting |
Self- supporting |
Non-self- supporting, bonded with substrate |
Reagent Resis - tance |
Affected by Nitric Acid68%&Sulfuric Acid98% |
Affected by Nitric Acid65% , Sulfuric Acid98%,Chromic Acid60%,Hydrofluoric Acid48%& Phenol |
Affected by Nitric Acid65% , Sulfuric Acid98%,Chromic Acid60%,Hydrofluoric Acid48%& Phenol |
Heat Resistance |
Resistant to 600¡æ, do not ignite or blister or crack when exposed to direct flame |
Resistant to 135¡æ ,not to be exposed to direct flame |
Resistant to 135¡æ ,not to be exposed to direct flame |
Reparability |
Monolitic , non-porous ,reparable when scratched |
lrreparable when scratched on the surface |
lrreparable when scratched on the surface |
Compressive Strength |
40,100psi |
21,500psi |
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Flexural Strength |
7£¬400psi |
13,040psi |
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Tensile Strength |
11£¬100psi |
20,510psi |
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Rockwell M Hardness |
93,7 |
69 |
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Thermal Coefficient of Expansion |
1.48*10-5in./OF |
1.291*10-5in./OF |
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Water Absorption |
0.05% |
0.71% |
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Moisture Resistance |
Excellent |
Good |
Poor | |
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